NEPCON China 2022 Semiconductor Packaging Exhibition in Exhibition
IC Packaging Show in Show @NEPCON China 2022
About the Show
IC Packaging Show will be held at NEPCON China 2022. The show will be presented in the form of "Semiconductor Packaging Equipment Exhibition" + "Semiconductor Packaging Conference" + "OSAT Buyer Group".
Expected scale of the exhibition
80
exhibitors and brands
100
advanced packaging and testing equipment and solutions
12
hot topics in semiconductor industry
1,000
visitors from East China
Exhibition Highlights
【Highlight 1】2022 Semiconductor Packaging Conference - SiP and Advanced Packaging Sub-Forum & 3rd Generation Semiconductor Device Packaging Sub-Forum
There will be more than 20 sessions covering SiP and advanced packaging & third generation semiconductor packaging industry trends, process issues, technology routes, commercialization process, etc. The conference is expected to be held within 2 days.
More than 600 attendees are expected to come from packaging test houses, IC design, EMS houses to explore advanced packaging processes, semiconductor packaging equipment and material suppliers, etc. for networking and learning.
【Highlight 2】SiP system level packaging technology production line showcase area
展会现场将邀约各环节的领先设备供应商搭建SiP系统级封装产线，现场逐个讲解设备情况并结合可视化的生产演示。为观众带来“沉浸式”的产线布局与工艺，同时会有专业技术团队全程带领观众参观和讲解，为产业链提供创新解决方案。
【Highlight 3】OSAT Buyer Group
A group of 100 OSAT buyers will be invited to visit the exhibition site to discuss and exchange with the visitors and promote business matching.
Some of the participating buyers are:
Kinglong Technology (Suzhou) Co. |
Jiangsu Aisil Semiconductor Technology Co. |
Suzhou Gutech Electronics Co. |
Jiangsu Huicheng Optoelectronics Co. |
Changzhou Xinsheng Semiconductor Technology Co. |
Jiangsu Zhongke Zhixin Integrated Technology Co. |
Jiangsu Changdian Technology Co. |
Yangzhou Yangjie Electronic Technology Co. |
Changzhou Yingbo Technology Co. |
Jiangsu Goodwak Microelectronics Technology Co. |
Jiangyin Changdian Advanced Packaging Co. |
Anan Packaging & Testing (Shanghai) Co. |
Changzhou Yinhe Century Microelectronics Co. |
Changdian Technology (Chuzhou) Co. |
StarTech Jinpeng Semiconductor (Jiangyin) Co. |
Suzhou Jingfang Semiconductor Technology Co. |
Wuxi Electric Base Integrated Technology Co. |
Anhui Fuxin Microelectronics Co. |
SMIC Changdian Semiconductor (Jiangyin) Co. |
Suzhou Keyang Semiconductor Co. |
Infineon Technologies (Wuxi) Co. |
Hefei Tongfu Microelectronics Co. |
Sunrise Semiconductor (Kunshan) Co. |
Suzhou Tongfu Chaowei Semiconductor Co. |
Anhui Gilette Electronics Co. |
Hefei Simage Microelectronics Technology Co. |
Huatian Technology (Nanjing) Co. |
Suzhou Zhenkun Technology Co. |
Semiconductor Manufacturing (Shaoxing) Co. |
Hefei Xinhuicheng Microelectronics Co. |
Jiangsu Xinde Semiconductor Technology Co. |
Hitech Semiconductor (Wuxi) Co. |
Changdian Technology (Suqian) Co. |
Jie Min Electronics (Hefei) Co. |
Zhejiang Yizhong Intelligent Electric Co. |
ZiGuang HongMao Microelectronics (Shanghai) Co. |
【Highlight 4】Industry and Trade Matching
现在即可报名NEPCON &“ICPF展中展”贸易对接活动，您将受邀进入现场展区并参与现场会议，您也将有机会向现场专家进行发问，针对问题一对一获得解答，更有机会会见更多产业链企业进行贸易对接。
Previous on-site forum review
Past Speakers
Xu Wei
Vice Chairman of China Semiconductor Industry Association Secretary General of Shanghai IC Industry Association
Teng Ran
General Manager of IC Industry Research Center, China IC Research Institute
Zhao Chenglong
MEMS process expert, Shanghai Weir Semiconductor Co.
Xie Hong
General Manager of SLI Technology Center, Tomflight Microelectronics Co.
Zhang Yifeng
Chief Executive Officer, Guangdong Liyang Chip Test Co.
Liu Hongjun
Vice President, Suzhou Jingfang Semiconductor Technology Co.
Chen Qinglong
Head of Division, Suzhou IST (Shanghai) Testing Technology Co.
Zhong Lei
Director of Engineering Research and Development, YongSi Electronics (Ningbo) Co.
Xie Jianyou
Chief Analyst (former Chief Scientist of SIP of Tongfu)
Jian Zhao
Vice President, Advanced Process Business Unit, Microminiaturized System Modules & Advanced Processes
Ma Qinggang
Sales Director, Hangzhou Changchuan Technology Co.
Cheng Gang
Sales Director, Henkel (China) Investment Co.
Yibo Liu
Associate Director of Marketing Strategy, Amcor Packaging & Testing (Shanghai) Co.
Song Yongqi
Deputy Director of Technology R&D Center, Nitto Smart Equipment Technology (Shenzhen) Co.
Yixhong Peng
Senior R&D Director, Ruijie Micro Technology (Group) Co.
Santosh Kumar
Chief Technical Analyst Yole Korea Principal Analyst Yole Korea
Farhang Yazdani
President and CEO of BroadPak Corporatian The President and CEO of BroadPak Corporatian
Qidong Wang
The President and CEO of BroadPak Corporatian
Summary of previous sessions
The 2nd China IC & Micro Assembly Industry Breakthrough and Innovation Summit
China International Electronics Manufacturing Summit Sub-Forum II: Advanced Packaging Technology Forum
Contact Us
For conference sponsorship, please contact
Name: Mr. Xu Yibing
Telephone Number: +86 21 2231 7051
Email Address：[email protected]
For conference sponsorship, please contact
Name: Mr. Xu Yibing
Telephone Number: +86 21 2231 7051
Email Address：[email protected]
For visitors, please contact
Name: Ms. Sun Mei
Telephone Number: 400 650 5611
Email Address：[email protected]
Or click here to register http://reedexpo.mikecrm.com/csNr90o