The Global Expansion of Advanced Semiconductor Packaging Facilities: A 2025 Outlook

The Global Expansion of Advanced Semiconductor Packaging Facilities: A 2025 Outlook

The semiconductor industry is experiencing a surge in investment and expansion of advanced packaging facilities, driven by increasing demand for high-performance computing and other applications. Several key players are significantly expanding their capacity, aiming for substantial production increases by 2025. This expansion is geographically diverse, with major projects underway in Taiwan, Malaysia, and China.

Taiwan: Taiwan remains a central hub for advanced packaging, with significant expansions planned and underway. Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding, inaugurated a new facility in Tanzi Science Park and announced plans for three more, boosting its overall capacity. ASE Technology Holding itself is expanding its presence in Taiwan and Malaysia. In Taiwan, ASE is investing heavily in new facilities and acquiring existing ones to expand wafer bumping, flip-chip packaging, and CoWoS capabilities. TSMC, a leading foundry, is also expanding its advanced packaging capacity across multiple locations in Taiwan.

Malaysia: ASE Technology Holding is significantly expanding its presence in Malaysia, notably through the acquisition of land in Penang’s GBS Technology Park for advanced packaging expansion. This demonstrates the growing importance of Southeast Asia in the global semiconductor landscape.

China: China is witnessing substantial investments in advanced packaging, with several major projects underway. Companies like TF Microelectronics, HT-Tech, SJSEMI, JCET, WYsemi, and FHEC are investing billions of Chinese Yuan in new facilities focused on various advanced packaging technologies, including multi-layer stacking, flip-chip, wafer-level, and panel-level packaging. While some projects are already partially operational, others are still in the planning or construction phases, with full production expected by 2025 or later. These investments highlight China’s ambition to become a major player in the advanced packaging sector.

Source: AnySilicon

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