Semiconductor Fair | The Rise of China's Chip Industry: From Independent Breakthrough to Global Competition

In the wave of digital transformation, chips, as the cornerstone of information technology, are becoming the strategic high ground in global technological competition. Faced with the urgent demand for chips in fields such as 5G communications, artificial intelligence, and high-performance computing, China, as the global hub for electronic product manufacturing, is accelerating the rise of its domestic chip industry. This process not only concerns technological independence but also profoundly impacts the reshaping of the global semiconductor industry landscape.

According to the Semiconductor Fair, in recent years, China's chip industry has made breakthroughs in both fundamental research and industrial application. The lithium tantalate hetero-integrated wafer and high-performance photonic chips developed by the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, are a prime example of domestic technological breakthroughs. This innovation, known as "optical silicon," offers a new pathway to overcome the physical limitations of traditional silicon-based chips, with extremely low optical loss and efficient electro-optic conversion properties. The research findings, published in Nature, mark China's entry into the global forefront of optoelectronic chips. Dr. Luo Rentong, an expert in digital economy application practice, pointed out that such technological breakthroughs not only validate China's high-end chip R&D capabilities but also open new possibilities in key fields like communications and quantum computing.

Innovations at the corporate level are equally noteworthy. MediaTek’s Dimensity 9300+ chip, based on a 4nm process and an all-large-core CPU architecture, redefines the intelligence boundary of smartphones with outstanding AI computing power—real-time image translation, voice generation, and other functions are driving mobile terminals to evolve into "smart hubs." Meanwhile, Sijia Photonics has solidified the foundation of optical communication networks with its leading PLC splitter and AWG chips. Hengton Optoelectronics has made strides in offshore wind power and marine communication systems, achieving a leap from the domestic market to the global stage. O-Net Technologies, as a global leader in optoelectronic devices, continues to increase its market share in transmission and access devices. Hitec has demonstrated strong potential in high-end equipment and integrated circuit manufacturing, showcasing the strength of domestic alternatives. The collective rise of these enterprises has not only built the competitive edge of the domestic chip industry’s full supply chain but also injected vitality into global semiconductor innovation with the "China solution."

However, the path of China’s chip industry is far from smooth. International technological blockades, supply chain fluctuations, and the approaching physical limits of Moore's Law force the industry to seek solutions through independent innovation. Especially in the "post-Moore era," the effectiveness of traditional technological paths is narrowing, and disruptive technologies like photonic chips and 3D integration have become key to breaking through. Meanwhile, the explosive growth of emerging scenarios like 5G, the Internet of Things, and autonomous driving provides the chip industry with a vast market but also raises higher requirements for performance, power consumption, and cost.

In the face of a complex internal and external environment, policy support and ecosystem collaboration have become the core of breakthroughs. In 2022, China’s research and development expenditure surpassed 3 trillion yuan, with an R&D intensity of 2.54%, providing a solid backing for technological advancements. At the national level, innovative tools such as "technology insurance" are used to reduce enterprise risks. Financial institutions have increased funding for the semiconductor field, while local governments focus on chip industry cluster construction, promoting deep integration of industry, academia, and research. This multi-party collaborative ecosystem is helping domestic chip enterprises break through the "bottleneck" predicament, gradually achieving a leap from catching up to parallel running and even leading.

The Semiconductor Fair believes that the vast opportunities of China’s chip industry also come with challenges. On the one hand, the evolution of cutting-edge technologies like artificial intelligence and quantum computing will continue to broaden the application boundaries of chips. On the other hand, increasing global competition and geopolitical risks require the industry to find a balance between open collaboration and independent control. It is foreseeable that as technological breakthroughs accumulate and the supply chain matures, more "China chips" will shine in fields such as communications, smart manufacturing, and scientific research, contributing innovative momentum to the global semiconductor industry and writing a new chapter in the transformation from a "manufacturing giant" to an "intelligent manufacturing powerhouse.

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