TSMC to Invest $100 Billion in U.S. Semiconductor Manufacturing, Expanding Commitment to AI and Tech Innovation

On March 4th, TSMC Chairman CC Wei, alongside U.S. President Donald Trump, announced that TSMC plans to invest $100 billion (approximately ¥728.5 billion) over the next four years to support advanced semiconductor manufacturing in the U.S. This follows TSMC's previous $65 billion investment in advanced semiconductor manufacturing in Phoenix, Arizona. With this new investment, TSMC's total investment in the U.S. is expected to reach $165 billion (approximately ¥1.202 trillion).

The additional $100 billion investment will fund the construction of three new semiconductor fabs, two advanced packaging facilities, and a key research and development team center. This project is one of the largest foreign direct investments in U.S. history.

Through this expanded investment, TSMC expects to create semiconductor value worth billions of dollars in the U.S. for artificial intelligence (AI) and other forward-looking applications. Additionally, this expansion is projected to support approximately 40,000 construction jobs in the U.S. over the next four years, while also generating tens of thousands of high-paying, high-tech jobs in advanced chip manufacturing and R&D. Over the next decade, this investment is expected to drive more than $200 billion in indirect economic output in Arizona and across the U.S.

TSMC emphasized that this move highlights its commitment to supporting U.S. customers, including leading AI and technology innovation companies like Apple, NVIDIA, AMD, Broadcom, and Qualcomm.

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