Siemens Digital Industries Software and TSMC Expand Collaboration to Drive New Project Development, Product Certification, and Technological Innovation

Siemens Digital Industries Software and TSMC have further strengthened their collaboration to advance the development of new projects, product certifications, and technological innovations based on TSMC’s latest process technologies. By integrating Siemens’ EDA solutions with TSMC’s industry-leading chip manufacturing and advanced packaging technologies, the two companies aim to empower mutual customers to develop highly differentiated end products.

Dan Kochpatcharin, Head of TSMC’s Ecosystem and Alliance Management, stated:
“By continuing our collaboration with Siemens, a valued partner in our Open Innovation Platform® (OIP) ecosystem, TSMC remains at the forefront of accelerating 3D IC design and AI innovation. Our long-standing partnership with Siemens enables mutual customers to fully leverage the performance, efficiency, and capabilities of TSMC’s cutting-edge technologies.”

N2/N3 Certification

Siemens' Calibre® nmPlatform tools have now been certified for TSMC’s N2 and N2P process technologies. The N2 certification includes support for Calibre’s new Local Standard Verification Rule Format (LSVRF), allowing localized rule checks within designated processor regions to enhance verification accuracy. Additionally, the collaboration around Siemens’ Calibre products includes TSMC’s certification of Calibre xACT™ software for N2.

Siemens has also collaborated with TSMC to certify simulation tools within the Siemens Solido™ Simulation Suite for analog, mixed-signal, RF, and memory design. Both Siemens’ Solido SPICE and Analog FastSPICE (AFS) solutions have been certified for TSMC’s N2 and N2P process nodes. Furthermore, as part of TSMC’s Custom Design Reference Flow (CDRF) for the N2 process, Siemens’ AFS tools now support TSMC’s reliability-aware simulation technologies, addressing IC aging and real-time self-heating effects while providing advanced reliability features. TSMC’s N2 CDRF also integrates Siemens’ Solido™ Design Environment software for advanced variation-aware verification.

To support next-generation physical implementation design, TSMC has certified Siemens’ Aprisa™ place-and-route software for its N3E and N3P process nodes, delivering new levels of performance and power efficiency for Aprisa users.

Expanding Collaboration

Siemens and TSMC are also expanding their collaboration into silicon photonics. The two companies are developing a process methodology that enables customers to fully utilize TSMC’s Compact Universal Photonic Engine (COUPE) silicon photonics technology using Siemens’ tools. Ongoing projects include Tanner™ custom IC tools for photonic IC design, Xpedition™ Substrate Integrator software for system assembly, and Calibre® 3DStack software for full COUPE system-level physical verification.

Siemens and TSMC have also jointly defined and validated Calibre 3DThermal, Siemens’ new thermal analysis solution for verifying and debugging advanced 3D ICs.

Expanding Services: Siemens Joins TSMC Design Center Alliance

Siemens has officially joined the TSMC Design Center Alliance (DCA). As a DCA member, Siemens provides a comprehensive range of services to help TSMC customers succeed in their designs, whether they are startups or large enterprises. Siemens’ services span critical stages of the IC design process, including place-and-route support, design-for-testability, functional verification, hardware-accelerated emulation, custom memory development, and IC packaging solutions. Global customers have partnered with Siemens’ service organization to bring innovative products to market across AI, high-performance computing (HPC), and other rapidly growing sectors.

Cloud-Based Innovation

As part of TSMC’s Secure Chamber cloud initiative, TSMC and Siemens have successfully deployed Siemens’ Calibre, mPower, and AFS toolsets on AWS Cloud. This initiative demonstrates the accuracy of cloud-certified tools for TSMC’s N3/N2 processes, showcasing their ability to optimize performance and accelerate problem resolution within a secure, cloud-based environment. These efforts aim to streamline tape-out workflows, improve efficiency, and enhance overall design quality.

Mike Ellow, CEO of Silicon Systems at Siemens Digital Industries Software, commented:
“The success of our collaboration with TSMC enables us to deliver certified, cutting-edge solutions based on the latest process technologies to our mutual customers. By combining Siemens’ best-in-class IC design tools with TSMC’s advanced process and packaging technologies, we empower customers to drive transformative innovation.”

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