See How QTING’s Spectra-Wafer Is Redefining Precision in 2.5D/3D Packaging at NEPCON China 2025

March 26 – QTING Tech successfully delivered the Spectra-Wafer, a wafer-level 2D+3D measurement equipment, to a leading domestic packaging and testing customer. This milestone delivery demonstrates QTING Tech' deep technological expertise in the advanced packaging field and marks the successful recognition of the product by a top-tier client.

In the context of a complex and dynamic global market environment, QTING Tech remains committed to technological innovation as the core driving force, dedicated to providing domestic alternative products that rival and exceed the performance of imported equipment. The Spectra-Wafer equipment delivered integrates high-speed, high-precision 2D+3D systems, AI intelligence, and other technological features, representing the industry's top-tier level. The product has established a strong reputation among a range of leading clients.

Spectra-Wafer Product Highlights

Based on its self-developed 3D optical system and AI intelligent algorithms, QTING Tech has launched the Spectra series 2D+3D measurement equipment, fully leveraging the synergies of optical, mechanical, electrical, software, and computing to provide more advanced testing equipment and powerful technical support for WLP and 2.5D/3D bump production inspection.

2D Vision System: Equipped with AI 2.0 Detection Network

The 2D vision system of the Spectra-Wafer features a high-speed, large-target, low-noise industrial camera paired with a high-power lighting system to precisely capture small defects. The application of AI 2.0 deep neural network technology significantly reduces the need for a large number of defect samples traditionally required by AI recognition networks, enabling rapid deployment and greatly enhancing the accuracy and efficiency of complex defect recognition and classification.

3D Vision System: High-Speed, High-Precision 3D Measurement

The 3D vision system of Spectra-Wafer is equipped with QTING Tech' proprietary high-speed, high-precision 3D measurement module. It has undergone deep optimization for 3D imaging of bumping, surpassing the technical specifications of imported equipment in the same model, providing reliable guarantees for key parameter measurements in advanced packaging.

Comprehensive Testing Capabilities

With full functionality, the Spectra-Wafer can precisely identify scratches, dirt, bubbles, cracks, bump height, bump coplanarity, and other critical parameters, offering comprehensive and high-precision testing support for quality control in advanced packaging processes.

As Moore's Law reaches its limits, and with the strong rise in demand for computational chips like GPUs and HBM, a new generation of 2.5D/3D advanced packaging technologies, such as the COWOS process, is emerging. Advanced packaging has entered the era of three-dimensional stacking, making 3D detection of inter-wafer connection bumps crucial. A single defective bump could cause the failure of an expensive chip set, with the number of bumps on each wafer often exceeding several million or even tens of millions. QTING Tech' Spectra series equipment solves a series of technical challenges related to 3D wafer measurement and makes significant progress toward domestic alternatives for this type of equipment.

QTING Tech Supporting the Industry

To date, the Spectra series equipment from QTING Tech has been widely recognized and used by renowned advanced packaging manufacturers and IDM companies in the industry. QTING Tech adheres to the mission of "becoming an internationally leading, domestically leapfrogging optical measurement equipment company," closely collaborating with the technological innovations of the advanced packaging industry, continuously creating value for customers, strengthening weak links in the industry chain, and contributing to the comprehensive development of the semiconductor industry ecosystem.

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