April 22-24, 2025
Shanghai World Expo Exhibition & Convention Center

NEPCON China 2025: A Grand Showcase of Surface Mount Technologies

The 33rd NEPCON China will be held from April 22 to 24, 2025, at the Shanghai World Expo Exhibition & Convention Center. The event will bring together leading global suppliers in PCB assembly, showcasing the latest technologies and products across key electronics manufacturing processes, including surface mount technology (SMT), test and measurement, soldering, dispensing and coating, automation, auxiliary equipment and materials, and electrostatic protection.

Booth No.: 1F38

Dual-Arm 20-Head High-Speed Mounter

  • Calibration Method: Flying Camera + Fixed Camera (Optional)
  • Number of Mounting Heads: 2 Arms × 10 Heads
  • Mounting Speed: 92,000 CPH
  • Mounting Accuracy: ±28μm (Chip), ±30μm (QFP)
  • Component Range: 03015 – 15mm
  • Mounting Area:
    • Minimum: L50 × W40
    • Single Track: Max L510 × W460
    • Dual Track: Max L510 × W250 (Standard) / L510 × W250 (Optional)

 

 

Booth No.: 1G101

211 Nozzle Smart Sorting & Cleaning System

  • High-speed cleaning
  • Supports "magazine" loading
  • Fully automated loading and unloading
  • No manual tray arrangement required

 

 

Booth No.: 1B23

XC-Shamrock – Intelligent Batch Component Counter

  • Fully automated feeding, scanning, counting, marking, and data uploading
  • Compact size, high efficiency, stable precision
  • Entirely hands-free operation
  • Automated calculations and result generation
  • Seamless integration with management systems for traceability
  • Self-learning image processing algorithm

 

 

Booth No.: 1E37

Compressed Air Temperature Controller

  • Precise temperature control and low-temperature cooling of compressed air
  • Utilizes Peltier temperature control and heat pump balance technology
  • Ensures stable and continuous supply of temperature-regulated compressed air

 

 

Booth No.: 1B50

Integrated Rework & Insertion Machine

  • Designed for SMT PCB/FPC/HDI fixture production
  • Suitable for single/multi-board production lines
  • Used in automatic solder paste printing, dispensing, conformal coating, and post-AOI processes
  • Enables high-end automation line configurations

 

 

Booth No.: 1F50

Fully Automated Online Printing & Labeling Machine

  • High flexibility and stable precision
  • Enhances production efficiency
  • Quick template switching for different products and label specifications
  • Integrated printing and labeling without manual intervention
  • Supports material sizes from Min 2×2mm to Max 100×40mm (Feeder size optional)
  • Online label printer supports Min 6×6mm labels

 

Pre-register for NEPCON China 2025: https://ali2.infosalons.com.cn/reg/NEPCON25SH/registeren/login?type=WE9ZIC

Join us at NEPCON China 2025 April 22-24, 2025, for an unparalleled opportunity to expand your network, engage in direct business matchmaking, and access innovative technologies that will shape the future of electronics manufacturing!

If interested in exhibiting at NEPCON China, please contact

Ms. Julia Gu

Tel: +86 21-2231-7010

Email: [email protected] 

 

If interested in visiting NEPCON China, please contact

Mr. Walden Li

Email:  [email protected], [email protected]  

Mobile/WhatsApp/WeChat:  +86 136-5125-1335

 

For TAP service, please contact:

Mr. Alan Li

Email: [email protected]

 

For media partnerships, please contact:

Ms. Yuri Yu 

E-mail: [email protected][email protected]  

 

Ms. Chopin Mo 

E-mail: [email protected]

 

Follow us on:

Facebook: @NEPCONASIA

Twitter: @Nepcon_Official

LinkedIn: @NEPCON ASIA