The 33rd NEPCON China will be held from April 22 to 24, 2025, at the Shanghai World Expo Exhibition & Convention Center. The event will bring together leading global suppliers in PCB assembly, showcasing the latest technologies and products across key electronics manufacturing processes, including surface mount technology (SMT), test and measurement, soldering, dispensing and coating, automation, auxiliary equipment and materials, and electrostatic protection.
NEPCON China 2025: A Grand Showcase of Surface Mount Technologies
Booth No.: 1F38
Dual-Arm 20-Head High-Speed Mounter
- Calibration Method: Flying Camera + Fixed Camera (Optional)
- Number of Mounting Heads: 2 Arms × 10 Heads
- Mounting Speed: 92,000 CPH
- Mounting Accuracy: ±28μm (Chip), ±30μm (QFP)
- Component Range: 03015 – 15mm
- Mounting Area:
- Minimum: L50 × W40
- Single Track: Max L510 × W460
- Dual Track: Max L510 × W250 (Standard) / L510 × W250 (Optional)
Booth No.: 1G101
211 Nozzle Smart Sorting & Cleaning System
- High-speed cleaning
- Supports "magazine" loading
- Fully automated loading and unloading
- No manual tray arrangement required
Booth No.: 1B23
XC-Shamrock – Intelligent Batch Component Counter
- Fully automated feeding, scanning, counting, marking, and data uploading
- Compact size, high efficiency, stable precision
- Entirely hands-free operation
- Automated calculations and result generation
- Seamless integration with management systems for traceability
- Self-learning image processing algorithm
Booth No.: 1E37
Compressed Air Temperature Controller
- Precise temperature control and low-temperature cooling of compressed air
- Utilizes Peltier temperature control and heat pump balance technology
- Ensures stable and continuous supply of temperature-regulated compressed air
Booth No.: 1B50
Integrated Rework & Insertion Machine
- Designed for SMT PCB/FPC/HDI fixture production
- Suitable for single/multi-board production lines
- Used in automatic solder paste printing, dispensing, conformal coating, and post-AOI processes
- Enables high-end automation line configurations
Booth No.: 1F50
Fully Automated Online Printing & Labeling Machine
- High flexibility and stable precision
- Enhances production efficiency
- Quick template switching for different products and label specifications
- Integrated printing and labeling without manual intervention
- Supports material sizes from Min 2×2mm to Max 100×40mm (Feeder size optional)
- Online label printer supports Min 6×6mm labels
Pre-register for NEPCON China 2025: https://ali2.infosalons.com.cn/reg/NEPCON25SH/registeren/login?type=WE9ZIC
Join us at NEPCON China 2025 April 22-24, 2025, for an unparalleled opportunity to expand your network, engage in direct business matchmaking, and access innovative technologies that will shape the future of electronics manufacturing!
If interested in exhibiting at NEPCON China, please contact
Ms. Julia Gu
Tel: +86 21-2231-7010
Email: [email protected]
If interested in visiting NEPCON China, please contact
Mr. Walden Li
Email: [email protected], [email protected]
Mobile/WhatsApp/WeChat: +86 136-5125-1335
For TAP service, please contact:
Mr. Alan Li
Email: [email protected]
For media partnerships, please contact:
Ms. Yuri Yu
E-mail: [email protected],[email protected]
Ms. Chopin Mo
E-mail: [email protected]
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Facebook: @NEPCONASIA
Twitter: @Nepcon_Official
LinkedIn: @NEPCON ASIA