The DH-A5 is a high-end BGA rework system featuring a large infrared preheating platform and a three-zone precision temperature control system (top/bottom hot air + bottom infrared). It ensures even PCB heating, minimizes thermal stress, and guarantees soldering quality.
Equipped with a high-precision CCD camera and bi-directional X/Y feeding platform, it supports multi-angle observation and precise alignment before and after chip removal/soldering. Compatible with BGA, QFN, and other package types, the system includes a 10-inch smart touchscreen for customizable temperature curves, real-time correction, and curve analysis, simplifying operation. Widely adopted by Google, Micron, Huawei, Xiaomi, and others, it enhances rework efficiency and yield.
Join us at NEPCON China 2025 April 22-24, 2025, for an unparalleled opportunity to expand your network, engage in direct business matchmaking, and access innovative technologies that will shape the future of electronics manufacturing!
Pre-register for NEPCON China 2025: https://ali2.infosalons.com.cn/reg/NEPCON25SH/registeren/login?type=WE9ZIC
If interested in exhibiting at NEPCON China, please contact
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Ms. Chopin Mo
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