The Snapdragon X Elite platform enters the market, intensifying competition between x86 and Arm architectures. Meanwhile, new players such as MediaTek and NVIDIA are joining the race, driving industry innovation and highlighting the sector’s immense market potential and dynamic growth. However, challenges remain, including high-precision manufacturing requirements, quality control of complex components, production pressure under rapid iteration, inefficiencies in multi-device coordination, cost optimization, and technological barriers in smart transformation. Addressing these challenges requires cutting-edge technologies and innovative solutions.
NEPCON China 2025 will take place from April 22–24 at the Shanghai World Expo Exhibition & Convention Center. Be part of the breakthroughs in computer and peripheral manufacturing! In advance, we’ve curated five leading solutions in this sector for you!
This edition features top solutions, including:
- AX1-TD, an online 3D X-ray inspection system by AXTEK
- Tekscan pressure distribution measurement system by Memstec
- Inductive smart material rack by STAR-WISE
- DFX Execution System by Vayo
- FAIS-G3 fully automatic flying probe tester by TJT
These powerful solutions enhance cost efficiency and streamline production. Join us in exploring the future of computer and peripheral manufacturing!