April 22-24, 2025
Shanghai World Expo Exhibition & Convention Center

Driving the Future: 5 Cutting-Edge Automotive Electronics Solutions at NEPCON China 2025!

With continuous advancements in artificial intelligence, 5G communication, and the Internet of Things (IoT), the automotive electronics industry is rapidly transitioning towards intelligence, electrification, and connectivity. However, challenges such as low sensitivity of components, inefficiencies in manual loading and unloading, difficulty ensuring precision, large-scale mass production barriers, high production costs, and slow inspection speeds continue to hinder the industry's growth.

To address these challenges, NEPCON China 2025 will take place from April 22-24, 2025, at the Shanghai World Expo Exhibition & Convention Center. Ahead of the event, we are excited to introduce five top-tier automotive electronics solutions that will help manufacturers enhance efficiency and reduce costs.

 

Booth No.: 1G10

SCHUNK SE & Co. KG, a global leader in tool and workpiece clamping, gripping, and automation technology, was founded in 1945. Serving customers in mechanical engineering, robotics, automated assembly, automotive manufacturing, and component supply, SCHUNK provides comprehensive depaneling solutions, including equipment selection, fixture design, milling parameter optimization, and debugging, catering to high miniaturization, high sensitivity, and stringent quality requirements.

SAR-Nano Offline Depaneling and Material Handling Solution

✔ Integrated with local material handling solutions for automation
✔ High-precision, high-speed magnetic levitation linear motor
✔ Compact footprint and lightweight design
✔ Powerful dust extraction system
✔ Universal magnetic fixture, compatible with SAR-1300
✔ Economical version with essential features

 

Booth No.: 1H40

Leveraging over 20 years of thermal technology expertise from JT Automation, THERLICON Technology specializes in semiconductor thermal processing equipment, offering standard and customized solutions such as semiconductor packaging soldering equipment, wafer bumping soldering machines, flux coaters, formic acid vacuum soldering equipment, nitrogen curing ovens, pressure ovens, and vacuum reflow soldering machines.

TRV Series Vacuum Reflow Soldering

  • Enables automated mass production with vacuum soldering
  • Reduces production costs while improving process efficiency
  • Built-in vacuum module with segmented extraction; reduces void rates to below 1%
  • Compatible with standard reflow soldering temperature profiles for easy adjustments

 

Booth No.: 1C25

Established in 2012 in Shenzhen, PEMS specializes in intelligent tin paste management cabinets and plasma cleaning machines. Their diverse product line includes tin paste storage solutions, plasma cleaning machines, visual barcode readers, and dispensers, all customizable to meet industry needs. The intelligent tin paste management cabinet integrates automatic refrigeration, temperature recovery, and monitoring functions, significantly enhancing production efficiency and quality control.

TS-1000 Intelligent Tin Paste Management Cabinet

  • Fully automated storage with integrated cooling, warming, stirring, and real-time tracking
  • First-in, first-out (FIFO) management ensures paste quality
  • Uniform temperature control and customizable MES integration to reduce waste and enhance efficiency

 

Booth No.: 1F31

QTING Tech brings together experts in computational optical imaging, semiconductor metrology, and machine vision. Specializing in ultra-precision semiconductor metrology solutions, the company provides comprehensive inspection systems for industries including advanced packaging, power devices, and electronics manufacturing.

Prisma Pro – China’s First High-Speed Side Camera 3D AOI

  • Breakthrough solution addressing limitations of traditional 3D AOI reconstruction
  • Enables accurate 3D solder climb detection
  • 50% faster than conventional 3D AOI systems
  • Side camera imaging supports multi-angle programming

 

Booth No.: 1F30

Founded in 2005, Vayo is a trusted software solution provider for digitalized electronic system design and manufacturing. By leveraging DFX, DFM, DFA, and SMT technologies, Vayo enables manufacturers to identify quality defects at the design stage, ensuring a seamless transition to digital and intelligent manufacturing. With over 800 enterprises across 20+ countries using Vayo solutions, the company continues to lead the industry.

Vayo-DFX Design Execution System

  • New-generation board-level EDA solution for PCB/PCBA design and manufacturing
  • Detects design flaws affecting reliability, manufacturability, assembly, and testing
  • Offers a rich library of review rules and a flexible management module
  • Utilizes 3D assembly visualization for digital rule-building and quality assurance

 

Join NEPCON China 2025 to experience these groundbreaking innovations firsthand. Whether you're looking to enhance precision, reduce costs, or improve efficiency, these five automotive electronics solutions will revolutionize your manufacturing process!

https://ali2.infosalons.com.cn/reg/NEPCON25SH/registeren/login?type=T07LFW

If interested in exhibiting at NEPCON China, please contact

Ms. Julia Gu

Tel: +86 21-2231-7010

Email: [email protected] 

 

If interested in visiting NEPCON China, please contact

Mr. Walden Li

Email:  [email protected], [email protected]  

Mobile/WhatsApp/WeChat:  +86 136-5125-1335

 

For TAP service, please contact:

Mr. Alan Li

Email: [email protected]

 

For media partnerships, please contact:

Ms. Yuri Yu 

E-mail: [email protected][email protected]  

 

Ms. Chopin Mo 

E-mail: [email protected]

 

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