NEPCON China is Leading B2B event in electronics assembly field. It brings together leading industry brands, innovating new areas of IC packaging, attracting emerging companies to join and integrating new resources in key fields. The concurrent highly interactive events include conferences, competitions, award program and business matchmaking, provide a great business networking and learning platform for expanding new businesses in fast-growth industries and regions. It helps you to explore future opportunities in new fields such as AI, humanoid robotics and the low-altitude economy by gaining insight into industry exchanges and learning about industry trends.

Held on April 22-24, 2025 at the Shanghai World Expo Exhibition & Convention Center, the show is expected to exceed 45,000㎡, attracting more than 500 enterprises and brands to exhibit, carrying out more than 20 summit and activities. Exhibitor segments of NEPCON China 2025 including SMT，test & measurement equipment，dispensing & spraying equipment，smart factory，semiconductor packaging and testing equipment，electronic components, etc. The show focus on technologies and solutions for 3C, automotive electronics, new energy, wireless communication devices and systems, rail transit related technology.

NEPCON China 2025 will showcase many innovative technologies and products. NEPCON ∞ SPACE is set to unveil a dedicated smart car disassembly zone, strategically designed to engage buyers from the smart car manufacturing supply chain. The showcase will feature a comprehensive demonstration line for packaging and testing processes, including the aspects of integrated circuits, optical modules, and power modules. In addition, the event will host Country Days, factory tours, and exclusive matchmaking sessions for overseas buyers from Vietnam, Malaysia, Indonesia, and other specialty regions, ensuring an impressive and engaging experience for all attendees.